Tariffkit

ECCN

Not legal advice. Tariffkit is a free research tool. It quotes HTS rate text and ECCN control text as published by the official sources linked here. It does not classify an item, does not apply rulings, and does not calculate duty. Verify the cited release with those sources and with counsel before you rely on it.

3B903

3B903 Scanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices or integrated circuits, having all of the following (See List of Items Controlled).

Category
Category 3—Electronics
Product group
B. “Test”, “Inspection” and “Production Equipment”

Reason for Control

  • NS
  • RS
  • AT

Official text

License Requirements

Reason for Control:

NS, RS, AT

Control(s) Country chart (see Supp. No. 1 to part 738)

  • NS applies to entire entry Worldwide control. See § 742.4(a)(5) and (b)(10) of the EAR.
  • RS applies to the entire entry Worldwide control. See § 742.6(a)(10) and (b)(11) of the EAR.
  • AT applies to entire entry AT Column 1.

List Based License Exceptions (See Part 740 for a Description of All License Exceptions)

LVS: N/A

GBS: N/A

IEC: Yes, see § 740.2(a)(22) and § 740.24 of the EAR.

Special Conditions for STA

STA: License Exception STA may not be used to ship any item in this ECCN to any of the destinations listed in Country Group A:5 or A:6 (See Supplement No. 1 to part 740 of the EAR).

List of Items Controlled

Related Controls: See ECCNs 3D901 for related “development” or “production” “software”, ECCN 3E901 for related “development” and “production” “technology”.

Related Definition:

N/A

Items:

a. Stage placement accuracy less (better) than 30 nm;

b. Stage positioning measurement performed using laser interferometry;

c. Position calibration within a field-of-view (FOV) based on laser interferometer length-scale measurement;

d. Collection and storage of images having more than 2 x 10 8 pixels;

e. FOV overlap of less than 5 percent in vertical and horizontal directions;

f. Stitching overlap of FOV less than 50 nm; and

g. Accelerating voltage more than 21 kV.

Note 1:

3B903 includes SEM equipment designed for chip design recovery.

Note 2:

3B903 does not apply to SEM equipment designed to accept a Semiconductor Equipment and Materials International (SEMI) standard wafer carrier, such as a 200 mm or larger Front Opening Unified Pod (FOUP).

ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28

Issue date 2026-08-28. Amendment date 2026-08-28.

This page quotes the loaded release. A shareable report freezes this text.

Back to search

Was this helpful?

A short note about this page. Not shown on the site.

Free research lookup of official HTS and ECCN text.

Keep me posted on new data

Optional email when the official files or this lookup change. Search stays free.