ECCN
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3B994
3B994 Semiconductor manufacturing equipment that enables “advanced-node integrated circuit” production, as follows (see list of items controls), and “specially designed” “components” and “accessories” therefor.
- Category
- Category 3—Electronics
- Product group
- B. “Test”, “Inspection” and “Production Equipment”
Reason for Control
- RS
- AT
Official text
License Requirements
Reason for Control:
RS, AT
Control(s) Country Chart (see Supp. No. 1 to part 738)
- RS applies to entire entry See § 742.6(a)(11) of the EAR.
- AT applies to entire entry AT Column 1.
List Based License Exceptions (See Part 740 for a Description of All License Exceptions)
LVS: N/A
GBS: N/A
Special Conditions for STA
STA: License Exception STA may not be used to ship or transmit commodities specified in this ECCN to any of the destinations listed in Country Group A:5 or A:6 (See supplement no.1 to part 740 of the EAR).
List of Items Controlled
Related Controls: (1) See ECCNs 3D994 and 3E994 for associated software and technology controls. (2) For additional controls that apply to this ECCN, see also § 744.11(a)(2)(v) and § 744.23(a)(4) of the EAR.
Related Definitions: N/A
Items:
Note for 3B994:
Equipment specified in this ECCN 3B994 are limited to equipment designed for volume production, such as equipment designed to accept a SEMI standard wafer carrier such as a 200 mm or larger Front Opening Unified Pod or be connected to a multi-chamber wafer handling system.
a. [Reserved]
b. Semiconductor wafer fabrication equipment designed for ion implantation of 300mm wafers as follows:
b.1. [Reserved]
b.2. Ion implantation equipment as follows:
b.2.a. Having all of the following:
b.2.a.1. Beam current greater than 1uA and less than 5mA; and
b.2.a.2. Beam energy greater than 5 keV and less than 300 keV; or
b.2.b. Having all of the following:
b.2.b.1. Beam current greater than 5 mA; and
b.2.b.2. Beam energy less than 5 keV; or
b.2.c. Having angular accuracy equal to or less (better) than 0.1 degrees.
c. through p. [Reserved]
q. Inspection and metrology equipment as follows:
q.1. and q.2. [Reserved]
q.3. Optical thin film metrology equipment or optical critical dimension metrology equipment designed for 300mm wafers and containing software designed for measuring non-planar transistors.
ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28
Issue date 2026-08-28. Amendment date 2026-08-28.
- eCFR Commerce Control List (15 CFR 774, Supplement No. 1)www.ecfr.gov
- eCFR versioner XML captured at ingestwww.ecfr.gov
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