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ECCN

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3C002

3C002 Resist materials as follows (see List of Items Controlled) and “substrates” coated with the following resists.

Category
Category 3—Electronics
Product group
C. “Materials”

Reason for Control

  • NS
  • AT

Official text

License Requirements

Reason for Control:

NS, AT

Control(s) Country chart(see Supp. No. 1to part 738)

  • NS applies to entire entry NS Column 2
  • AT applies to entire entry AT Column 1

List Based License Exceptions (See Part 740 for a Description of All License Exceptions)

LVS: $3,000

GBS: Yes for 3C002.a provided that they are not also controlled by 3C002.b through .e.

List of Items Controlled

Related Controls: N/A

Related Definitions: N/A

Items: a. Resists designed for semiconductor lithography as follows:

a.1. Positive resists adjusted (optimized) for use at wavelengths less than 193 nm but equal to or greater than 15 nm;

a.2. Resists adjusted (optimized) for use at wavelengths less than 15 nm but greater than 1 nm;

b. All resists designed for use with electron beams or ion beams, with a sensitivity of 0.01 µcoulomb/mm 2 or better;

c. [Reserved]

d. All resists optimized for surface imaging technologies;

e. All resists designed or optimized for use with imprint lithography equipment specified by 3B001.f.2 that use either a thermal or photo-curable process.

ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28

Issue date 2026-08-28. Amendment date 2026-08-28.

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