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ECCN

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3D993

3D993 “Software” for the “development” or “production” of commodities specified in 3B993 and “software” as follows (see List of Items Controlled).

Category
Category 3—Electronics
Product group
D. “Software”

Reason for Control

  • RS
  • AT

Official text

License Requirements

Reason for Control:

RS, AT

Control(s) Country Chart (see Supp. No. 1 to part 738)

  • RS applies to entire entry See § 742.6(a)(11) of the EAR.
  • AT applies to entire entry AT Column 1.

List Based License Exceptions (See Part 740 for a Description of All License Exceptions)

TSR: N/A

Special Conditions for STA

STA: License Exception STA may not be used to ship or transmit “software” specified in this ECCN to any of the destinations listed in Country Group A:5 or A:6 (see supplement no.1 to part 740 of the EAR).

List of Items Controlled

Related Controls: For additional controls that apply to this ECCN, see also § 744.11(a)(2)(v) and (a)(3) and § 744.23(a)(4)(iii) of the EAR.

Related Definitions: N/A

Items:

a. “Software” “specially designed” for the “development” or “production” of commodities specified in 3B993.

b. 'Electronic Computer-Aided Design' ('ECAD') “software” designed or modified for the “development” or “production” of integrated circuits using multipatterning.

c. 'Computational lithography' “software” designed or modified for the “development” or “production” of patterns on DUV lithography masks or reticles.

Technical Note:

For the purposes of 3D993, 'computational lithography' is the use of computer modelling to predict, correct, optimize and verify imaging performance of the lithography process over a range of patterns, processes, and system conditions.

d. “Software” designed or modified to increase the number of wafers processed per hour, averaged over any time interval, by greater than 1%, of equipment specified in 3B001.f.1 or 3B993.f.1.

e. “Software” not specified by 3D993.a designed or modified to perform all of the following in or with deep-ultraviolet immersion photolithography equipment:

e.1. Decrease the minimum resolvable feature specified by 3B993.f.1.b.1; and

e.2. Decrease the maximum 'dedicated chuck overlay' of deep-ultraviolet immersion lithography equipment above 1.5 nm and below or equal to 2.4 nm.

ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28

Issue date 2026-08-28. Amendment date 2026-08-28.

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