ECCN
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3E003
3E003 Other “technology” for the “development” or “production” of the following (see List of Items Controlled).
- Category
- Category 3—Electronics
- Product group
- E. “Technology”
Reason for Control
- NS
- AT
Official text
License Requirements
Reason for Control:
NS, AT
Control(s) Country chart(See Supp. No. 1 to part 738)
- NS applies to entire entry NS Column 1.
- AT applies to entire entry AT Column 1.
List Based License Exceptions (See Part 740 for a Description of All License Exceptions)
TSR: Yes, except .f and .g
List of Items Controlled
Related Controls: See 3E001 for Silicon-On-Insulation (SOI) technology for the “development” or “production” related to radiation hardening of integrated circuits.
Related Definitions: N/A
Items:
a. Vacuum microelectronic devices;
b. Hetero-structure semiconductor electronic devices such as high electron mobility transistors (HEMT), hetero-bipolar transistors (HBT), quantum well and super lattice devices;
Note:
3E003.b does not control “technology” for high electron mobility transistors (HEMT) operating at frequencies lower than 31.8 GHz and hetero-junction bipolar transistors (HBT) operating at frequencies lower than 31.8 GHz.
c. “Superconductive” electronic devices;
d. Substrates of diamond for electronic components;
e. Substrates of Silicon-On-Insulator (SOI) for integrated circuits in which the insulator is Silicon Dioxide (SiO2);
f. Substrates of Silicon Carbide (SiC) for electronic components;
g. “Vacuum electronic devices” operating at frequencies of 31.8 GHz or higher;
h. Substrates of Gallium Oxide (Ga2O3) for electronic components.
ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28
Issue date 2026-08-28. Amendment date 2026-08-28.
- eCFR Commerce Control List (15 CFR 774, Supplement No. 1)www.ecfr.gov
- eCFR versioner XML captured at ingestwww.ecfr.gov
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