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Search a US HTS code, an ECCN, or words from the official description. Each result is either the import schedule or the Commerce Control List, with the release and the source it came from.

Not legal advice. Tariffkit is a free research tool. It quotes HTS rate text and ECCN control text as published by the official sources linked here. It does not classify an item, does not apply rulings, and does not calculate duty. Verify the cited release with those sources and with counsel before you rely on it.

Searched the Commerce Control List. This query is an ECCN or EAR99.

ECCN

ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28

ECCN

3E004

3E004 “Technology” “required” for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a 'Site Front least sQuares Range' ('SFQR') less than or equal to 20 nm at any site of 26 mm x 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm.

Category: Category 3—Electronics
Product group: E. “Technology”

Reason for Control

ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28

eCFR Commerce Control List (15 CFR 774, Supplement No. 1)www.ecfr.gov
eCFR versioner XML captured at ingestwww.ecfr.gov

Open code page

/eccn/3E004

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