ECCN
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3E004
3E004 “Technology” “required” for the slicing, grinding and polishing of 300 mm diameter silicon wafers to achieve a 'Site Front least sQuares Range' ('SFQR') less than or equal to 20 nm at any site of 26 mm x 8 mm on the front surface of the wafer and an edge exclusion less than or equal to 2 mm.
- Category
- Category 3—Electronics
- Product group
- E. “Technology”
Reason for Control
- NS
- AT
Official text
License Requirements
Reason for Control:
NS, AT
Control(s) Country chart(See Supp. No. 1 to part 738)
- NS applies to entire entry NS Column 1.
- AT applies to entire entry AT Column 1.
List Based License Exceptions (See Part 740 for a description of all license exceptions)
TSR: Yes
List of Items Controlled
Related Controls: N/A
Related Definitions: For the purpose of 3E004, 'Site Front least sQuares Range' ('SFQR') is the range of maximum deviation and minimum deviation from front reference plane, calculated by least square method with all front surface data including site boundary within a site.
Items:
The list of items controlled is contained in the ECCN heading.
ecfr-15cfr774-supp1-2026-08-28 · effective 2026-08-28
Issue date 2026-08-28. Amendment date 2026-08-28.
- eCFR Commerce Control List (15 CFR 774, Supplement No. 1)www.ecfr.gov
- eCFR versioner XML captured at ingestwww.ecfr.gov
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